Total lot screening of microelectronics is utilized to assist in achieving levels of quality and reliability commensurate with the intended application. As a DSCC Certified Microcircuit Manufacturer, Minco performs 100% of the screening requirements of MIL-STD-883, Method 5004.
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Screen
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Method
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Class level S
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Class level B
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Wafer lot acceptance
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5007
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All Lots
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N/A
|
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Nondestructive bond pull
|
2023
|
100%
|
N/A
|
|
Internal visual
|
2010
|
Condition A
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Condition B
|
|
Temperature cycling
|
1010
|
Condition C
|
Condition C
|
|
Constant acceleration
|
2001
|
Condition E, Y1 Only
|
Condition E, Y1 Only
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|
Visual inspection
|
|
100%
|
100%
|
|
Particle impact noise detection (PIND)
|
2020
|
Condition A
|
N/A
|
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Serialization
|
|
100%
|
N/A
|
|
Pre burn-in electrical parameters
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|
In accordance with applicable specification
|
N/A
|
|
Burn-in test
|
1015
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240 hours at 125°C minimum
|
160 hours at 125°C minimum
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|
Interim (post burn-in) electrical parameters
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|
In accordance with applicable specification
|
In accordance with applicable specification
|
|
Reverse bias burn-in
|
1015
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Condition A or C, 72 hours at 150°C minimum
|
N/A
|
|
Percent defective allowable (PDA) calculation
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|
5 percent, 3 percent, functional parameters at 25°C
|
5 percent
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Final electrical test
Static tests
1) 25°C (subgroup 1, table I, 5005)
2) Maximum and minimum rated operating temperature (subgroups 2, 3, table I, 5005)
Dynamic or functional tests
1) 25°C (subgroup 4 or 7, table I method 5005) Minimum and maximum rated operating temperature (subgroups 5 and 6, or 8 table I method 5005)
Switching tests at 25°C
(subgroup 9, table I, method 5005)
|
|
In accordance with applicable specification
|
In accordance with applicable specification
|
|
Seal - Fine and Gross
|
1014
|
100%
|
100%
|
|
Radiographic
|
2012
|
Two views
|
N/A
|
|
Qualification or quality conformance inspection test sample selection
|
|
|
|
|
External visual
|
2009
|
100% or 116/0
|
100% or 116/0
|
|
Radiation latch-up
|
1020
|
110%
|
100%
|
