DIE PROCESSING:

As an industry leader in wafer and die processing, Minco maintains a full semiconductor processing capability. We offer wafer probe to various temperatures and specifications. We have the capability to saw different size wafers along with different metalizations. Packing bare die and visual inspection also offers a wide selection for you to pick from including a vast selection of waffle packs and gel packs. Don't forget that Minco also has the capability for many assembly related services and test services.