Services | Testing & Packaging | Die Processing

Services | Testing & Packaging | Die Processing

Comprehensive assembly, environmental and electrical test services

Unique programs require specific solutions. Generic products and answers will not produce the high-reliability (Hi-Rel) components required for your program or project. With a 30+ year history, Minco Technology Labs, LLC has become a leader in the Hi-Rel component and custom packaging industry, therefore providing capabilities and resources necessary to meet demanding assembly, environmental and electrical test requirements.

Our engineering staff has a diverse skill set and extensive experience in the design and production of advanced packaging and test solutions. Utilize that experience and customer dedication to plan your mission-critical project. We can assist you in creating a market-specific solution for your program requirements. Speak with a member of our team today to get more information.

Full range of die processing services to meet your needs

The wide range of die processing and distribution services we offer includes the safeguards of die visual inspection and 100% wafer probing to various temperatures and specifications. Through precise sawing, we can saw wafers of assorted size and metallization to meet your project requirements. We also provide customers with a variety of packaging options, including waffle packs, gel packs, wafer sawn on ring-frame and myriad custom packaging solutions.

Meticulous semiconductor testing services to ensure quality

A DLA-certified microcircuit manufacturer, Minco Technology Labs, LLC has an extensive general testing list, covering areas including environmental testing and screening, mechanical testing and qualification and quality conformance. Our qualified semiconductor test program library often can reduce your project's start-up costs and lead times.

Quality Hi-Rel and third-party customer packaging for your unique requirements

Mission-critical programs often require Hi-Rel components with custom packaging. From source control drawings to manufacturing capabilities, our custom semiconductor packaging can be designed for your project-specific requirements, including end-of-life and obsolete semiconductor components. Our engineers design and assemble high-quality aftermarket packaging that is then subject to painstaking requirements testing.

Needed resources and expertise to handle your inventory management

To fulfill projected demand of long-term military programs and other market-specific requirements, our inventory and obsolescence management can maintain your specified die and packaged products in desired quantities at bonded inventory locations.

Expertise to best meet your program requirements – Contact our team today

When you work with Minco Technology Labs, LLC, we respect your requirement for the best solution for your project and your need for a quick response. When you request a quote, we will typically respond within 24-48 hours. For immediate assistance, call our Hi-Rel packaging and die sales team to discuss your project's specific requirements.


About Minco Technology Labs, LLC: Minco Technology Labs, LLC, headquartered in Austin, TX, is a leading provider of mission critical high reliability (Hi-Rel) semiconductor packaged solutions, die processing, and test services.  Minco services advanced technologies with state of the art solutions, as well as hard to find, obsolete or end-of-life products for multiple applications.  Minco Technology Labs, LLC is a Leading Value Added Supplier of High Reliability Components, Semiconductor Die Processing, Assembly, Test Services and Distribution. Minco serves the Military, Aerospace, and Energy, Transportation, Heavy Industrial and other specialty markets.