Process Flow

FLOWCHART
INCOMING/ASSY/REWORK
PROCESS
STEP
DESCRIPTION INSPECTION/
TEST CRITERIA
Incoming Raw
Material
Inspection
Wafers, Die Visual

Dimensional

Thickness

C of C Verification

Packages and Lids Dimensional

C of C Verification

Packaging Materials Shelf Life

C of C Verification

Wafer Probe
(If Required)
100% Die Level Electrical, Test Rejects Are Red Inked  
Wafer
Probe Monitor
Monitor Probing Probe Defects
Kit for Assembly Wafer(s) or Die are Kitted with Packages and Lids, Minco Bonding Diagram and Manufacturing Router  
Wafer Mount
(If Required)
Preparation for Die Separation  
Wafer Mount
Monitor
  Visual Inspection
Wafer Saw
(If Required)
Die Separation Alignment Accuracy
Wafer Wash Wash Wafer Utilizing High Pressure DI Water N/A
Wafer Saw
Monitor
Saw KERF Saw Quality
Saw Accuracy
Die Visual Visually Inspect Die Visual Inspection
Die Visual
Process Monitor
Visually Inspect Die Visual Inspection
Die Attach Die Bonded to Package Defects
Epoxy/
JM7000 Cure
Check Oven Temperature Epoxy Cure
Temperature
Die Attach
Monitor
  Visual Quality

Die Shear Test

Wire Bond Gold Ball Bonds 0.7 to 1.25 Mil Wire Aluminum Wedge Bonds 1.0 to 25 Mil Wire Defects
Wire Bond
Monitor
  Visual Quality

Wire Bond Pull Test

Pre-Cap
Inspection
Visual Inspection in Accordance with Mil-Std-883, Method 2010, Class B Visual Inspection
Hermetic Seal Solder Reflow, Glass Frit, Compression Weld  
Post Seal Visual
Inspection
Visually Inspect the Package Seal Visual Inspection
Marking Mark parts Accordance with Applicable Specification Visual Inspection
Stabilization Bake
(If Required)
Bake devices in Accordance with Applicable Specification N/A
Temperature Cycle Temperature Cycle in Accordance with Mil-Std-883, Method 1010 N/A
Constant Acceleration Centrifuge in Accordance with Mil-Std-883, Method 2001 N/A
External Visual
Inspection
Visually Inspect in Accordance with Mil-Std-883, Method 1010 Visual Inspection
Fine Leak Test Fine Leak in Accordance with Mil-Std-883, Method 1014 Helium Mass
Spectrometer
Gross Leak Test Gross Leak in Accordance with Mil-Std-883, Method 1014 Fluorocarbon Bubble
Test
Pre Burn-In Electrical
Parameters
Test devices in Accordance with Applicable Specification Electrical Test
Burn-In Burn-In Devices in Accordance with Mil-Std-883, Method 1015 and Applicable Specification  
Interim (Post Burn-In) Electrical Parameters Test devices in Accordance with Applicable Specification Electrical Test
Percent Defective
Allowable (PDA)
  Calculation of Lose From Pre Burn-In Parameters to Interim Burn-In Parameters
Final Electrical Test Test devices in Accordance with Applicable Specification Electrical Test
External Visual Visually Inspect in Accordance with Mil-Std-883, Method 2009 Visual Inspection
Quality Conformance
Inspection Sample
Selection
  Sample Selection