Hi-Rel & Custom Packaging | High-Reliability semiconductor

Hi-Rel & Custom Packaging | High-Reliability semiconductor

For 30 years, Minco Technology Labs, LLC has lead the High-Reliability (Hi-Rel) and custom packaging industry. Minco is a DLA qualified manufacturer and assembler of end-of-life and obsolete semiconductor components. We provide QML standard parts used in military, aerospace, medical, high-temperature, and other harsh environment and industrial applications.

As a certified AS9100 and ISO9001-2000 company, Minco specializes in Hi-Rel technologies, services and solutions. We supply both standard and custom products to adapt to each customer’s unique requirements. With a firm grasp on existing and emerging technologies, our sales organization is represented in more than 30 nations worldwide. Minco offers the superior expertise to design and produce advanced test solutions, including third-party packaging and test services. We provide DLA certified aftermarket solutions, discontinued integrated circuit applications, continuous SMD support for discontinued SMD services, and more.

Comprehensive Hi-Rel services include:

Packaging

  • Pin-Grid-Array
  • “J” Lead LCC
  • Metal Cans
  • Chip-On-Board
  • Flat Pack
  • Dual In-Line
  • Quad Flat Pack
  • Leadless Chip Carriers
  • Ball-Grid-Array
  • Flip-Chip
  • Chip Scale
  • Land-Grid-Array

Testing

  • Environmental
  • Mechanical
  • Microcircuit Screening
  • Qualification and Quality Conformance Inspection

Assembly

  • Die Attach
  • Hermetic Seal
  • Wire Bond
  • Precap Visual

 

Minco Technology Labs, LLC is a Leading Value Added Supplier of High Reliability Components, Semiconductor Die Processing, Assembly, Test Services and Distribution. Minco serves the Military, Aerospace, and Energy, Transportation, Heavy Industrial and other specialty markets.