Quality die processing from an industry leader for exceptional results

Your project requires high-reliability (Hi-Rel) semiconductor components, which leaves little room for error. As an industry leader in wafer and die processing, Minco Technology Labs, LLC maintains a full semiconductor processing capability. As outlined below, our rigorous die processing procedure has been built on years of experience and meets your mission-critical project requirements. Contact our team for a die processing quote and we will respond to you within 24-48 hours.

Visual inspection to remove defects in all die products

You cannot afford for your die products to have defects. At Minco Technology Labs, LLC, your bare die components are skillfully inspected by veteran inspectors, who have completed rigorous training and certification testing. Our technicians perform an exhaustive three-part die visual inspection to ensure technical accuracy and prompt delivery of superior merchandise.

Wafer probe to ensure post-assembly integrity

The sample wafer probing technique of some other bare die manufacturers is not enough to ensure the integrity of the wafer. Missed inherent problems could result in low electrical yields after the wafer has been assembled into units, which could increase your assembly and tests costs. To save you these potential costs, Minco Technology Labs, LLC follows the requirements of MIL-PRF-38534. By completing a 100% wafer probe, we make sure every die has been tested and passes the manufacturer's spec.

Carefully orchestrated wafer saw process to prevent die damage

Your Hi-Rel semiconductor components must meet precise specifications. Wafer sawing is the critical first step in die processing. To ensure the precision and reliability of your bare die products, our highly qualified wafer saw operators carefully consider the full range of variables, including blade speed, cut patterns and the electrical charge of the DI water. Our process also includes the most contemporary technology to mount, secure, cut and clean each wafer, ensuring your specifications are met.

Pick and place automation for quick and precise custom packaging

Following the wafer saw process, the individual bare die must be removed from the wafer tape and packaged. This is another critical process in die processing because excessive contact force could damage the die. At Minco Technology Labs, LLC, we use a pick and place machine (when feasible) to remove the die. The automation not only minimizes the chance of mechanical damage, but it also increases the speed of the process.

With a wide variety of packaging options, including waffle packs, gel packs, wafer sawn-on ring-frame and custom packaging; you can get the highest quality product available within expeditious turnaround times. Call or email our die sales team today for more information.