Custom Packaging | Customer Packaging Provider

Custom Hi-Rel semiconductor packaging meeting your project's requirements

Mission-critical programs continue beyond the typical shelf life of a specific component. Unique-to-your-market projects may need specific high-reliability semiconductor components that are not readily available. These circumstances cannot hinder your program.

Minco Technology Labs, LLC is a custom packaging provider offering a wide variety of custom semiconductor packaging and components from customer source control drawings (SCD) to manufacturing capabilities. We are also the leading manufacturer and assembler of end-of-life and obsolete semiconductor components. Based on your specific needs, we design and produce advanced test solutions that include a full range of product capabilities and services that extend the life of integrated circuits for mission-critical programs.

Experience providing you with product focus for hi-reliability markets

With more than 30 years of expertise, Minco Technology Labs, LLC is a certified AS9100 and ISO9001-2008 company providing product focus in the hi-reliability markets that serve the military, aerospace, medical and energy markets on a global scale. Request a quote or speak with a member of our Hi-Rel packaging team to get started today. You will get a response to your request typically within 24-48 hours, although custom quotes may take up to five business days.

Die bonding process includes die shear testing to ensure quality results

By incorporating die shear testing into the die bonding process, our engineers to assess the overall integrity of the materials and the capabilities of the processes used in mounting the die, ensuring you receive only quality components.

Wire bonding process removes contaminants from semiconductor packaging

The electrical connection of your project's components is reliant on fine bonding wires between the silicon chip and the external leads of the semiconductor device. The most common failure mechanism in wire bonding is contaminants on the bonding pad. The wire bonding process used at Minco Technology Labs, LLC includes a high pressure de-ionized water rinse and an argon etch to remove any debris and contaminants from the Hi-Rel semiconductor components.

Rigorous internal visual inspection prior to shipment to you

Hi-Rel semiconductor components can be damaged by physical mishandling or during the assembly process. Each of the Minco Technology Labs inspectors has expansive on-the-job experience and training in the handling and inspection of semiconductor products. During the internal visual inspection any defects are removed from custom semiconductor packaging.

Semiconductor industry sealing process specific to packaging type

The various materials used in different types of Hi-Rel semiconductor components determine the custom packaging process used during the hermetic sealing process. Our market-specific sealing process ensures your mission-critical Hi-Rel components are properly sealed.

 

Internal Visual Inspection - Capabilities

MIL-STD-750, Method 2072 - Transistors
MIL-STD-750, Method 2073 - Diodes
MIL-STD-883, Method 2010 Condition A - Integrated Circuits
MIL-STD-883, Method 2010 Condition B - Integrated Circuits
ESA SCC Specifications (1)
Customer Specifications