BARE DIE:

Minco has access to a numerous amount of manufacturers that offer a wide variety of product types. We also offer many die processing services and test services for not only Minco procured material but also consigned material as well. Die maps are available upon request.

Minco ensures that each die is electrically tested at the wafer level and that all failures are identified and removed from the lot when the dice are separated from the wafer. When wafer/die level testing requirements are not specified in the procurement documents, then Minco selects the parameters, conditions, and limits that will assure compliance with the electrical characteristics.

Our certified inspectors then visually examine each die to ensure conformance to the applicable die related requirements of method 2010 of MIL-STD-883; methods 2072 and 2073 of MIL-STD-750.

When a lot qualification is required a sample of microcircuit and semiconductor dice from each wafer lot are evaluated in accordance with Table C-II of MIL-PRF-38534. Minco assembles these test samples to closely simulate the assembly methods and conditions the element will see during their normal production assembly.

For Class H qualifications the sample will consist of at least 10 die from each wafer lot. A Class K sample will consist of 3 die from each wafer and a total of at least 10 die from each wafer lot [If one wafer is evaluated, then 10 die shall be tested, If 10 wafers are evaluated, then 30 die (3 from each wafer) shall be tested].

Minco then performs the interim, post burn-in, and/or final electrical tests with the following minimum static tests requirements:
a. + 25°C.
b. Maximum rated operating temperature.
c. Minimum rated operating temperature.

For each wafer lot tested, Minco selects a sample of at least 5 die requiring 10 bond wires minimum for wire bond strength testing. A scanning electron microscope (SEM) analysis of the dice metallization is performed for Class K qualifications.