Recognized as an industry leader in the design, manufacture, test, and distribution of semiconductor solutions that improve the quality of life and security for a better world.
Mission-critical Hi-Rel semiconductor packaging, test services, and die processing
When your project requires mission-critical high-reliability (Hi-Rel) semiconductor packaging and components, you need a manufacturer that delivers products and services that exceed expectations while providing exceptional customer service.
Since 1981, Minco Technology Labs, LLC has served the Hi-Reliability, die processing and semiconductor packaging for military (MIL-SPEC), aerospace, energy, transportation and other harsh-environment markets. An industry leader in the production of market-specific semiconductor packaging and equipment testing, Minco offers:
- Cost-effective turnkey solutions for current technology and end-of-life or obsolete semiconductor packaging and Hi-Rel components
- Quick response and on-time Hi-Rel component delivery
- Engineering support for design and production
- Extensive semiconductor component testing that meets conformance requirements
Market-specific semiconductor packaging, component testing and die processing
Our customer's unique program requirements cannot be met with generic product or service solutions. Minco Technology Labs, LLC a leading provider of high-reliability semiconductor components and services, carefully selects, manufactures and sources specific bare die, die processing and packaged semiconductor components that endure the extreme environmental factors of your industry.
Our wafer and die processing, custom packaging and semiconductor component testing are designed to meet unique customer requirements and Defense Logistics Agency (DLA) specifications, as needed.
Time-sensitive quotes for Hi-Rel components, packaging and testing
Applications, Environment and Product Offerings: From Transcript Of Minco Webinar: Hi-Reliability MOSFETS W/ Dave Harrison
Part 1: Transcript of Hi-Reliability Testing W/ Pat McCord - Leak Test Capabilities For Hermetically Packaged Semiconductors
I’d like to introduce myself. My name is Pat McCord. I’m the Vice President of Quality at Minco Technology Labs in Austin, Texas. I’ve got over 30 years of experience in military semiconductor assembly, testing and qualification. I’m a member of the JEDEC 13.2 committee and have been for 25 years, co-chairman of the committee for 8 years. I’m also currently the task group chairman for Test Method 1014, hermeticity testing and method 1018, residual gas analysis. And I recently published a White paper on a “One-way leak phenomena that has been seen in hermetic cavity packages.”
Download Minco: One-Way Leak Phenomena In Hermetic Cavity Packages Written By William Pat McCord, Minco Technology Labs, LLC - VP Of Quality
Hi-Reliability Testing W/ Pat McCord - Learn More About Leak Test Capabilities For Hermetically Packaged Semiconductor Devices
To our customers, suppliers and peers:
Minco Technology Labs is pleased to announce our certification from the, Defense Logistics Agency, DLA, which authorizes Minco to provide Mil-Std-750 Fine and Gross Leak Testing Services, as seen in the following attached image.
Minco is pleased to announce the release of our New Minco Designed and Built parts to help solve the re-occurring source of supply issues in the marketplace. These are just a few of the many parts that we are designing to help solve these issues in the near future. Read More >
Minco is a DLA qualified manufacturer with unmatched expertise in High Reliability (Hi-Rel) packaging. We lead our industry in the manufacturing and assembly of end-of-life and obsolete semiconductor packaging and components. Read More >